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Automatic Taping Machine - List of Manufacturers, Suppliers, Companies and Products

Automatic Taping Machine Product List

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Embossed carrier tape automatic taping device

Embossed carrier tape automatic taping device

Supply of electronic components and the like is carried out with a tray automatic exchange unit.

The PS-700T is a taping device that supplies electronic components and the like using a tray automatic exchange unit, transports and aligns the devices, inserts embossed carrier tape, distinguishes the front and back directions within the pockets, and automatically performs cover tape sealing and reel winding. ● Wide range of tape widths The tape width supports 8 to 44 mm The winding reel diameter ranges from Φ178 to 420 mm The supply reel diameter ranges from Φ178 to 670 mm

  • Taping Machine
  • Other semiconductor manufacturing equipment

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Automatic Taping Device AT468

Automatic Taping Device AT468

Semiconductors, dies, package sorters. This is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then repackages them.

AT468 is a semiconductor, die, and package sorter that supports various input and output types. It is a device that performs visual inspection after extracting from tubes, trays, and taping/reels, and then packages them into tubes, trays, and taping/reels.

  • Binding/Packing Machine
  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Appearance inspection, automatic taping device iSort

Appearance inspection, automatic taping device iSort

It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.

This is a semiconductor sorting device that performs visual inspection of the 5th and 6th sides of diced wafers, and transfers them to taping, reels, or trays. It is difficult to visually inspect the dies after dicing, so an automatic machine inspects for scratches and debris, determines good and defective products, and facilitates the transfer. 【Features】 ● Compatible with 8”, 12”, and diced wafers/film frames (WLCSP, BGA, eWLB, QFN, etc.) ● Supports taping and JEDEC/waffle trays ● Throughput: pph 20K ● Inspection items: - Co-planarity inspection of dies/solder balls/bumps - 5-side inspection - Die size - Cut line edge inspection - Marking inspection - Scratch and foreign matter inspection

  • Visual Inspection Equipment
  • Binding/Packing Machine
  • Taping Machine

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Automatic Taping Device Hexa EVO+

Automatic Taping Device Hexa EVO+

Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.

Hexa EVO+ is a device for inspecting 3D appearance defects on both sides of semiconductor IC packages, ball arrays, leads, etc., and automatically packaging dies, IC sorting, and handler appearance inspection. It can accommodate a variety of inspection items and various packages. 【Features】 ● Appearance inspection for packages under 100mm ● Throughput, UPH90K ● Dual taping output support ● Automatic position correction ● Defective component management ● Appearance inspection contents ・3D front and back appearance inspection ・Ball and pad inspection ・Front, back, and side appearance inspection ・Package thickness inspection ・Color inspection ・Crack inspection

  • Binding/Packing Machine
  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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